OFTech’s metal bond diamond powder is the powder with high concentrate particles, accurate size and irregular shape; use it for high performance metal bond tools to ensure excellent abrasive action and tight particle size distribution.
- Concentrate particles with accurate size and irregular shape to ensure excellent abrasive action and tight particle size distribution
- Blocky and etched surface
- Stringent oversize control
- Surfaces cleaned to extremely low levels of elemental impurities and ionic content
- Specific feed crystal source and monitoring
- Majority of sizes are from or proprietary Mesh-to-Micron process
The above characteristics make it to be perfect product for high pressure/high temperature, semiconductor and microelectronics applications. It is also used in wheel fabrication and high precision lapping and polishing applications.